Plasma for Underfill Process in Flip Chip Packaging
نویسندگان
چکیده
Driven by the fast growing demand for smaller, faster, and higher I/O electronic devices, flip chip technology has attracted significant attention in the electronic packaging industry. Flip chip is a proven packaging technology due to its high performance, reduced form factor, and greater I/O density. In successful flip chip packaging, the underfill process plays an important role because it can significantly increase the reliability and quality of the package. It can also increase the thermal fatigue life of the solder bump interconnects, protect the interconnect from the environment, and provide robustness against mechanical shock. Plasma treatment prior to the underfill process brings many benefits to the underfill dispensing process, such as it increases wicking speed, improves fillet height and its uniformity, and promotes interface adhesion. As a result, plasma treatment prevents delamination and void formation that can result in a shortened lifetime for microelectronic devices. Many factors can affect the plasma’s performance for the underfill process. Selection of the appropriate plasma chemistry and configuration is critical to the successful implementation of plasma prior to the underfill step. The flexibility of the radio frequency used with low pressure plasma allows the user to successfully utilize plasma for numerous material sets. In this paper, plasma chemistry and plasma performance with die, substrate, and underfill material will be reviewed and new experimental data will be shown.
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